03
2026-06
Synopsys has introduced a full IP portfolio for TSMC’s N6C and N4C cost‑optimized process nodes . Built on silicon‑prove...
02
2026-06
Qualcomm has launched the Yuelong IQ10 Robot Reference Design (RRD) , a full‑stack, production‑ready platform for indust...
02
2026-06
The NXP LPC11C12FBD48/301 is a highly integrated 32-bit microcontroller from the LPC1100C series, designed to deliver a ...
01
2026-06
Nvidia’s upcoming N1 series Arm‑based SoCs (N1X and N1) have leaked ahead of their official PC platform launch on June 1...
29
2026-05
Samsung has shipped the industry’s first 12‑stack HBM4E memory samples , delivering 48GB per stack . The new generation ...
28
2026-05
On May 27, ChangXin Memory Technology passed its STAR Market IPO review . The company – China’s largest integrated DRAM ...
27
2026-05
On May 27, PCB and laminates leader Kingboard Laminate announced another price hike – the second this year. The company ...
27
2026-05
NXP 74LVC08APW: A Comprehensive Technical Overview of the Low-Voltage Quad 2-Input AND Gate IC The NXP 74LVC08APW is a m...
26
2026-05
Samsung’s third‑largest union, Donghaeng – representing the Device Experience (DX) division (phones, TVs, home appliance...
26
2026-05
A new domestically developed chip‑scale MEMS active cooling fan is reportedly being tested for advanced Chinese processo...
25
2026-05
Unigroup Guoxin ( 002049.SZ ) announced a 263million(RMB1.9B)∗∗acquisitionof∗∗100263million(RMB1.9B)∗∗acquisitionof∗∗100...
20
2026-05
TSMC is accelerating its panel‑level packaging development, focusing on the 310×310mm mainstream size and conducting gla...
